Most eager to leave bankruptcy protection, Spansio

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To get out of bankruptcy protection, Spansion switched to the embedded market

Spansion recently said that due to the proper restructuring plan, the company is expected to get out of Chapter 11 bankruptcy protection in the fourth quarter of this year - Spansion applied for bankruptcy protection at the beginning of this year. Now, when it just entered the third quarter, the release of this message undoubtedly brings a glimmer of hope to the memory market, where there has been little good news in the past period of time

according to the world semiconductor trade statistics Organization (WSTS), since the third quarter of 2008, the global overall semiconductor market, overall memory and NOR flash memory market have faced a comprehensive sharp recession ranging from 23% to 34%. In the face of the extreme depression of the overall environment, the recession of span has also reached 31%, said John nation, director of corporate marketing of span

in order to save this company, which was first independent from AMD and Fujitsu's flash memory department and brought together the technology and process excellence of the former two parent companies, Spansion made efforts to restructure and significantly adjusted its strategic direction after applying for bankruptcy protection. "Wireless will no longer be our focus," John nation pointed out. Markets with huge changes but rapid decline in profit margins like this are no longer its focus. Spansion's future focus is on IP licensing business and embedded markets, including automotive, industrial, computing, communications and consumer electronics

when the pendulum is in the vertical downward rest position, John nation also said that in order to reduce operating costs, the company has closed a 12 inch wafer plant in sunnya, California, USA - in the heyday of the memory industry, the plant was used to develop the most advanced technology - now in the restructuring plan, the closed wafer plant will also have PP composite calcium carbonate or talc powder and PS foaming in the future; The other is that degradable materials will find another way out. Spansion will also adopt the mode of jointly developing new technologies with partners in the future

in addition, John nation stated that the Mou previously signed with Taiwan's packaging and testing factory riyueyue on the joint venture has also expired with the bankruptcy filing, but the company will continue to maintain and strengthen its partnership with all partners in the future

all kinds of actions show that Spansion is taking a pragmatic approach to return to the road of profit. In order to meet the challenge of the new generation of embedded products to memory technology, in addition to the nor product with a capacity of 2GB, John nation said that the company is also quite optimistic about the development of SPI nor and continues to expand its investment in this product

he quoted webfeet data to point out that by 2013, SPI will account for 40% of the overall nor market. At the same time, because the SPI nor interface can effectively shrink the package size and the number of pins of the chip to 80%, the effective transmission rate of the next generation products can even reach 80mb/s, which is suitable for embedded applications that need high efficiency, such as multi-function transaction machine (MFP), digital television (DTV), digital camera, Blu ray player, high-resolution STB, etc

in the second quarter of 2009, Spansion's net sales were $376million, slightly lower than the previous quarter. John Kispert, President and CEO of span, said in a statement to reporters that the cash department of span increased to $220million at the end of the second quarter, which is a considerable progress compared with the lack of cash at the beginning of the year

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